Program Overview

This doctoral program adheres to student-centered approach, guided by the improvement of original innovation and engineering practice abilities, and focuses on cultivating a group of high-level innovative talents and industry backbone in the field of modern electronic information with solid basic knowledge, high professional literacy, strong innovation and practical ability, a sense of mission, responsibility, and a good international perspective.

Research directions in this field: conductor heterojunction integration and advanced packaging, semiconductor manufacturing and processes, integrated circuit devices and design.

Core Courses

Modern Signal Processing, RF and mixed signal integrated circuit design, Optimization Theory and Applications, Modern Data Fusion Technology,Advanced Semiconductor Device Physics, etc.

Career Prospects

Industry, Postdoc, Research Institute, etc.

Consultation

Email:[email protected]                    

英文名

Junfa Mao

聯系郵箱

[email protected]

中文簡介

毛軍發，中國科學院院士，深圳大學校長。曾擔任上海交通大學副校長。1992 年于上海交通大學獲博士學位。1994年-1996年在香港中文大學和美國加州大學伯克利分校各做了1年訪問研究。主要研究高速與射頻集成電路，以及智能感知技術。他是中國電子學會會士、微波分會主任委員，中國通信學會會士，IEEE Fellow，973首席，國家自然基金委杰出青年基金獲得者、創新群體學術帶頭人以及基礎科學中心項目負責人。發表論文500多篇，其中IEEE 刊物論文160多篇。先后獲國家自然科學獎二等獎、國家技術發明獎二等獎、國家科技進步獎二等獎各 1 項，國家教學成果二等獎2項，負責的成果獲2020年中國高等學校十大科技進展。

英文簡介

Junfa Mao, CAS Academician, President of Shenzhen University. He was the Vice President of Shanghai Jiao Tong University. He received his Ph.D. degree from Shanghai Jiao Tong University in 1992. He was a Visiting Scholar at the Chinese University of Hong Kong (1994-1995) and the University of California, Berkeley (1995-1996). His main research interests include high-speed radio frequency integrated circuits and intelligent sensing technology. He is a fellow of the Chinese Institute of Electronics (CIE), the director of the Microwave Society of CIE, a fellow of the China Institute of Communications, IEEE Fellow, the Cheung Kong Scholar of the Ministry of Education, the Chief Scientist of the National Basic Research Program (973 Program) of China, a recipient of the National Science Fund for Distinguished Young Scholars, the Academic Leader of the Creative Research Groups of the National Natural Science Foundation of China and the Project Manager of the Fundamental Scientific Center.

He has authored or coauthored more than 500 papers (including more than 160 IEEE journal papers). He received the National Natural Science Award of China, the National Technology Invention Award of China, the National Science and Technology Advancement Award of China and two National Awards of Teaching. His research achievement was selected as one of Ten Major Scientific and Technological Progress of China's Colleges and Universities (2020).

英文名

Feng Rao

聯系郵箱

f[email protected]

中文簡介

饒峰，特聘教授。主要研究領域為半導體信息功能材料與器件，研究方向包括（1）新型相變信息存儲材料與器件、（2）外場作用下納米材料行為原位表征、（3）非晶態半導體材料選通材料與器件、（4）二維與異質結薄膜材料與器件。已發表Science、Mater. Today、Nat. Commun.、Nano Lett.等第一/通訊作者論文70余篇；獲中國授權專利40余項，美國專利5項。

英文簡介

Prof. Feng Rao’s main research field is semiconductor informatic functional materials and devices, with research directions including (1) novel phase-change memory materials and devices, (2) in-situ characterization of nanomaterials behaviors under external stimuli, (3) amorphous semiconductor materials for selector applications, and (4) 2D and heterostructured film and devices. He has published over 70 peer reviewed articles, including some in prestigious journals, such as Science, Mater. Today, Nat. Commun., Nano Lett., etc, and also has been authorized over 40 Chinese and 5 US patents.

英文名

Mark Huang

聯系郵箱

[email protected]

中文簡介

深圳孔雀A海外高層次人才（2019）， 深圳大學電子與信息工程學院和異質異構國家重點實驗室特聘教授，微電子研究院封測中心主任（2021-）），寧波大學材化學院安中講習教授（2018-2023），新加坡國立大學博士后（1996-1998），中國科學院化學研究所高分子化學博士（1996），在新加坡和美國工作18年，先后服務于日立化成（HCAP）任高級工程師，美光科技（Micron）任主任研究員，星科金朋（StatschipPAC）任高級經理，新加坡微電子研究所（IME）任技術顧問，瑞士SFS集團旗下Unisteel公司技術總監。2014回國加入碩貝德無線科技（SPEED）任CTO負責TSV制造和指紋模組封裝技術開發。

專業特長：

①各種類型IC封裝材料的應用和技術攻關；

②先進組裝技術開發與商業化，包括封裝倒裝芯片（FCIP）、系統封裝/多芯片模組（SiP/MCM）、晶圓級芯片封裝（WLCSP），銅柱互連（Cu-Pillar），硅通孔（TSV）和扇出扳 級封裝（FOPLP）；

③超薄晶片處理和成本可行的封裝解決方案；

④技術創新，共發表論文50余篇，持有美國專利60項，新加坡專利2項，中國發明專利10項，實用新型專利32項。

研究興趣: 高頻高速新材料開發和應用，半導體封裝技術(IC Assembly)，無線充電(WC)，物聯網（IoT）和車聯網（IoV）解決方案等。自2012年擔任中國半導體國際技術大會委員會委員兼封裝分會聯席主席（Co-Chair）。

成功商業化案例：1. 在新加坡工作期間，帶領研發團隊成功開發全球首款PVD緊固件產品用于蘋果手機5系列；2.開發性價比高的高阻隔密封材料可用于替代玻璃/陶瓷/金屬的封裝材料；

3.回國后開發全球首款硅通孔（TSV）指紋芯片工藝和新產品，用于華為手機。

英文簡介

National Distinguished Expert (2016), Shenzhen Peacock Plan Overseas High-Level Talents (2019), Distinguished Professor at Shenzhen University, School of Electronics and Information Engineering, Director of the Assembly and Testing Center at the Microelectronics Research Institute (2021-), Guest Professor at the College of Materials and Chemistry, Ningbo University (2018-), Postdoctoral Research Fellow at the National University of Singapore (1996-1998), Ph.D. in Polymer Chemistry from the Institute of Chemistry, Chinese Academy of Sciences (1996). Worked in Singapore and the United States for 18 years, serving as a Senior Engineer at Hitachi Chemical Advanced Packaging (HCAP), Director of Research at Micron Technology, Senior Manager at StatschipPAC, Technical Consultant at the Institute of Microelectronics (IME) in Singapore, and Technical Director at Unisteel, a subsidiary of the Swiss SFS Group. Returned to China in 2014 and joined Supebed Wireless Technology (SPEED) as the CTO, responsible for TSV manufacturing and fingerprint module packaging technology development.

Areas of expertise:

l Application and technical research of various types of IC packaging materials.

l Development and commercialization of advanced assembly technologies, including Flip Chip in Package (FCIP), System-in-Package/Multi-Chip Module (SiP/MCM), Wafer-Level Chip-Scale Packaging (WLCSP), Copper Pillar Interconnect (Cu-Pillar), Through-Silicon Via (TSV), and Fan-Out Panel-Level Packaging (FOPLP).

l Ultra-thin wafer handling and cost-effective packaging solutions.

l Technological innovation, with over 72 published papers, 70 granted US patents, 2 Singapore patents, 10 Chinese invention patents, and 32 utility model patents.

Research interests:

l Development and application of high-frequency and high-speed new materials, semiconductor packaging technology (IC Assembly), wireless charging (WC), solutions for the Internet of Things (IoT) and the Internet of Vehicles (IoV). Since 2012, serving as a committee member and co-chair of the Packaging Subcommittee of the China Semiconductor International Technology Conference.

l Successful commercialization cases:

n During my tenure in Singapore, led a research and development team to successfully develop the world's first PVD fastener product for the Apple iPhone 5 series.

n Developed high-cost-performance barrier sealant materials as alternatives to glass/ceramic/metal packaging materials.

n After returning to China, developed the world's first TSV fingerprint chip process and new product for Huawei smartphones.

英文名

Sai-Wai Wong

聯系郵箱

w[email protected]

中文簡介

王世偉，男，香港人，2017年10月加盟深圳大學，任電子與信息工程學院長聘教授。2003年獲香港科技大學電子工程本科學士學位，2003-2004分別在兩家香港企業擔任工程部主管。2005年和2009年分別獲新加坡南洋理工大學碩士和博士學位，2009-2010年聘為新加坡科技研究家資訊通信研究院研究員，2010-2016年任華南理工大學副教授、碩導，2016-2017年任華南理工大學教授、博導。教育部新世紀優秀人才支持計劃入選者（2013），2018年獲深圳海外高層次人才孔雀C類人才，2014年IEEE高級會員。發表學術論文200余篇，谷歌引用超過4000次，H因子31，獲授權發明專利超過60項，美國專利一項。主持國家自然科學基金項目和省市級項目多項。主要研究領域：微波電路與天線。

英文簡介

Sai-Wai Wong received his B.S degree in electronic engineering from the Hong Kong University of Science and Technology, Hong Kong, in 2003, and the M.Sc. and Ph.D. degrees in communication engineering from Nanyang Technological University, Singapore, in 2006 and 2009, respectively. From Jul. 2003 to Jul. 2005, he was an Electronic Engineer to lead an electronic engineering department in China with two Hong Kong manufacturing companies. From May 2009 to Oct. 2010, he was a Research Fellow with the Institute for Infocomm Research, Singapore. Since November 2010, He was an Associate Professor and later bcome a Professor, in the School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China. From Jul. 2016 to Sep. 2016, he is a Visiting Professor in City University of Hong Kong. Since 2017, He is a tenured Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen. His research interests include microwave/mmW/Terahertz circuit and antenna design. So far, he has authored and co-authored more than 200 papers in international journals and conference proceedings. His google paper citation is more than 4000 times. He holds more than 60 licensed Chinese invention patents and 1 USA patent. He has been serving as a reviewer for several top-tier journals such as IEEE TMTT, MWCL, AP and so on. He was the recipient of the New Century Excellent Talents in University awarded by the Ministry of Education of China in 2013. He is also the recipent of Overseas High-Caliber Personnal (Level C) in 2018.

英文名

Bin Liao

聯系郵箱

b[email protected]

中文簡介

廖斌，教授，新銳研究生導師，博士生導師，廣東省智能信息處理重點實驗室副主任。于2006年，2009年分別獲得西安電子科技大學電子信息工程學士和信息與信息處理碩士學位，2013年獲得香港大學電機與電子工程系博士學位。主要從事陣列信號處理，雷達信號處理、無線通信、通感一體化等研究。入選全球前2%頂尖科學家榜單，“終身科學影響力排行榜”，國家自然科學基金委員會與歐盟委員會“中歐人才項目”獲得者，"廣東特支計劃" 科技創新青年拔尖人才，深圳大學優秀青年教師“荔園優青”，深圳市海外高層次人才（孔雀計劃）B類，南山區“領航人才”B類獲得者。獲得教育部自然科學二等獎，第21屆（北京）和第22屆（倫敦）IEEE數字信號處理國際會議最佳論文獎，陜西省優秀畢業生，西安電子科技大學優秀畢業生，研究生優秀碩士學位論文特等獎，中國航天科技集團公司CASC一等獎學金等。主持10余項縱向科研項目，其中國家自然科學基金項目4項。在權威國際期刊和會議上發表論文150余篇。現為IEEE高級會員，IEEE 傳感器陣列與多通道信號處理 （SAM）技術委員會委員，擔任IEEE Transactions on Aerospace and Electronic Systems，Multidimensional Systems and Signal Processing（Springer），IET Signal Processing 等期刊副編輯（Associate Editor）。

英文簡介

Bin Liao (Senior Member, IEEE) received the B.Eng. and M.Eng. degrees from Xidian University, Xi’an, China, in 2006 and 2009, respectively, and the Ph.D. degree from the University of Hong Kong, Hong Kong, in 2013. From 2013 to 2014, he was a Research Assistant with the Department of Electrical and Electronic Engineering, The University of Hong Kong, where he was also a Research Scientist with the Department of Electrical and Electronic Engineering from August to October 2016. From March to June 2023, he was a Visiting Professor with the Centre for Wireless Innovation (CWI), Queen’s University Belfast, U.K. He is currently a Full Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. His research interests include sensor array processing, adaptive filtering, and convex optimization, with applications to radar, navigation, and communications. He was a recipient of the Best Paper Award in 2016 21st International Conference on Digital Signal Processing and 2017 22nd International Conference on Digital Signal Processing. He was a recipient of the National Natural Science Foundation of China and European Research Council (NSFC-ERC) programme. He is an Associate Editor of IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, IET Signal Processing, and Multidimensional Systems and Signal Processing.

英文名

Zhaocheng Yang

聯系郵箱

y[email protected]

中文簡介

陽召成，男，1984年生，博士，副教授，深圳大學新銳導師，軍隊三等功獲得者，省優秀博士論文獲得者，深圳市南山區“領航人才”，深圳市海外高層次“孔雀計劃”人才。2007年6月和 2013 年6月分別獲北京理工大學學士和國防科學技術大學信息與通信工程專業工學博士學位。2010年11月-2011年11月在University of York從事訪問研究；2013年6月-2015年8月在國防科技大學任教，2015年9月-至今在深圳大學任教。在雷達領域從事科研工作15年多，其研究方向為智能感知雷達與信息處理，其技術涉及雷達信號處理、多傳感器智能感知、陣列信號處理、稀疏表示、自動目標識別等。主持了國家、省多項自然科學基金、深圳市科技項目、企業合作橫向項目等十余項，參與國家自然科學基金、973、863等項目多項。目前，撰寫個人專著1本，獲得/申請國家發明專利60余項。在國內外高水平學術期刊和會議上發表和錄用學術論文90余篇，其中SCI檢索40余篇，榮獲2018年IET工程技術協會最佳論文獎。

英文簡介

Zhaocheng Yang received the B.E. degree in information engineering from the Beijing Institute of Technology, Beijing, China, in 2007, and the Ph.D. degree in information and communication engineering from the National University of Defense Technology, Changsha, China, in 2013. From November 2010 to November 2011, he was a Visiting Scholar with the University of York, York, U.K. From June 2013 to August 2015, he was a Lecturer with the School of Electronics Science and Engineering, National University of Defense Technology. He is currently an Associate Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. He served as the reviewer and the TPC member for many IEEE journals and conferences. His research interests include the area of array signal processing, adaptive signal processing, compressive sensing, machine learning, and edge intelligent sensing radar and its applications. He has published 1 book, more than 90 papers in journals/conferences and over 60 granted patents. He won the Excellent Doctoral Thesis of Hunan province, China, in 2015, and the IET Premium Awards for the best journal paper published in IET Signal Processing in 2018.

英文名

SHI Weiwei, Will

聯系郵箱

[email protected]

中文簡介

博士畢業于香港中文大學，主要研究方向為高能效低功耗數字集成電路設計，可穿戴腦機交互芯片及高效益邊緣計算人工智能芯片。及近年在國際會議和雜志上發表了二十余篇相關論文，其中近三年發表和收錄了十篇以上關于神經疾病腦電監控芯片、亞閾值數字/邏輯設計的國際會議和雜志論文（IEEE TCAS、TCAD、Access等等，IF 4.1-2.4）。

主持承擔國家自然科學基金面上項目、廣東省自然科學基金面上項目、廣東省青年創新人才項目及深圳市科技計劃項目等多個項目，作為主持人已結題及在研的經費總額達390萬以上，具有豐富的項目開展經驗。

英文簡介

SHI Weiwei received the Ph.D. degree in electronic engineering from the Chinese University of Hong Kong (CUHK) in 2011. He is now an associate professor in the Department of Microelectronics in Shenzhen University. His current research interests include digital system designs, especially IC designs on cost-and-energy efficient AI chips, approximate computation, subthreshold digital system, human-computer interface chips, and baseband processor in communication.

He has published over 20 papers in international conferences and key academic journals in recent years (IEEE TCAS, TCAD, Access and etc.), mainly on brain-computer interface chips, subthreshold digital designs and baseband processors. He has been appointed as PI for over 10 projects in recent 5 years supported by national and regional funds with over 4,500,000 RMB amount and abundant R & D experiences.

英文名

Xinke Liu

聯系郵箱

[email protected]

中文簡介

劉新科，廣東省杰青，深圳大學研究員/副教授，2008年獲得新加坡國立大學材料科學（榮譽）學位，2013年獲得新加坡國立大學電氣和計算機工程博士學位。他的研究興趣集中在GaN基功率半導體器件上。此外，他還在2019年9月至2020年8月期間擔任新加坡國立大學訪問學者，2018年5月至2018年7月期間擔任美國加州大學伯克利分校訪問學者。他撰寫了約110篇期刊論文（IEEE TED/EDL、APL/JAP、Adv.Mat.等），擁有約70項正在申請的專利和27/25項已授予/轉讓的專利。2023年獲深圳市青年科學技術獎，2022年獲廣東省科技進步獎，2022年度中國電子學會科技進步獎。

英文簡介

Xinke Liu received the B. Appl. Sc. (Hons) degree in Material Science from National University of Singapore (NUS) in 2008, and the Ph.D. degree in electrical and computer engineering from the NUS in 2013. He is currently an Associate Professor in Shenzhen University, and his research interest focus on GaN-based power semiconductor devices. In addition, he was also a visiting scholar in NUS from 2019.09 to 2020.08, and in University of California, Berkeley, US from 2018.05 to 2018.07. He has authored ~110 journal papers (IEEE TED/EDL, APL/JAP, Adv. Mat., etc), and has ~70 pending patents and 27/25 granted/transferred patents. He was conferred the Shenzhen Youth Science and Technology Award in 2023, the Guangdong Provincial Science and Technology Progress Award in 2022, the Science and Technology Progress Award of China Electronics Society in 2022, the Guangdong Distinguished Young Scholars in 2022. Google Scholar: https://scholar.google.com/citations?user=j3t4lMgAAAAJ&hl=en

英文名

Jiang Yang

聯系郵箱

[email protected]

中文簡介

姜洋博士，畢業于香港中文大學，曾任職于新加坡科技局高性能計算研究所，現為深圳大學“百人計劃”副教授。廣東省青年珠江人才，IEEE電磁兼容協會新加坡分會執行委員，長期致力于分元等效電路方法的異質異構集成仿真和電路驅動的人工智能仿真優化算法研究。研發了分元等效電路系列軟件，包括異質異構集成建模仿真、超材料智能設計、空氣放電可靠仿真、無接觸探測仿真等前沿問題的方法和引擎，獲得五項新加坡科技局專利和兩項軟件著作權。

已發表IEEE論文20余篇，其中IEEE T-MTT等頂級期刊論文5篇。提出的AI電路重構方法獲得2022年亞太電磁兼容會議“Highly-Recommended Paper Award”；；因在領域內的研究成果受到關注，2023年受到分元等效電路方法創始人Dr. Albert E. Ruehli邀請在EPEPS做專題報告。

英文簡介

Dr. Jiang Yang, graduated from the Chinese University of Hong Kong, previously worked at the Institute of High-Performance Computing. A*STAR in Singapore. He is currently an Associate Professor of the 'Hundred Talents Program' at Shenzhen University. He is a Guangdong Province Young Talent and an Executive Committee Member of the IEEE Electromagnetic Compatibility Society Singapore Chapter. He has been dedicated to research on heterogeneous and heterogeneous integration simulation using the Method of Partial Element Equivalent Circuits (PEEC) and circuit-driven AI simulation optimization algorithms.

He has developed a series of PEEC-based software, including methods and engines for modeling and simulation of heterogeneous integration, intelligent design of metamaterials, air discharge reliability simulation, and non-contact detection simulation, addressing cutting-edge problems. He has received five patents from A*STAR and two software copyrights.

Dr. Jiang has published more than 20 IEEE papers, including five in top journals such as IEEE T-MTT. His proposed AI circuit reconstruction method won the 'Highly-Recommended Paper Award' at the 2022 Asia-Pacific Electromagnetic Compatibility Conference. Due to his research achievements in the field, he was invited by Dr. Albert E. Ruehli, the founder of the PEEC method, to give a keynote talk at EPEPS in 2023

英文名

Dingguan Wang

聯系郵箱

[email protected]

中文簡介

王定官，助理教授/副研究員，博士生導師，射頻異質異構集成全國重點實驗室成員。2013年本科畢業于華中科技大學，2016年從中國人民大學獲得碩士學位（導師：王亞培），2021年從新加坡國立大學獲得博士學位（導師：Andrew Wee和Jishan Wu）。主要從事低維半導體薄膜制備與功能器件、射頻異質異構集成電路等方面的研究，發表論文30余篇。曾獲學術新星提名獎，研究生國家獎學金，優秀畢業生，優秀墻報獎等榮譽獎勵。長期擔任ACS Nano，Small，Langmuir， Materials Today Electronics等學術期刊的審稿人。

英文簡介

Dr. Dingguan Wang, Assistant Professor/Associate Researcher, Ph.D advisor, Member of National Key Laboratory of RF Heterogeneous Integration. Dr. Dingguan received his bachelor's degree from Huazhong University of Science and Technology in 2013, his master's degree from Renmin University of China in 2016 (Advisor: Prof. Yapei Wang), and his doctorate degree from National University of Singapore in 2021 (Advisors: Prof. Andrew Wee and Prof. Jishan Wu). Dr.Dingguan has been a reviewer for academic journals such as ACS Nano, Small, Langmuir, Materials Today Electronics.

Research Area: low-dimensional semiconductor synthesis and electronic devices, RF heterogeneous integrated circuits.

Awards: the Academic Rising Star Nomination Award, graduate National Scholarship, outstanding graduate, excellent poster award and other honorary awards.